Senior / Engineer - Bumping NPI

3 days ago


Singapore United Test And Assembly Center Limited (UTAC) Full time

Responsibilities Manages internal and customer projects from engagement until project closure through proper planning and timely execution by working with internal cross‐functional teams and customer Maintains documentation of customer projects starting from Kick‐off, Engineering build, Qualification and Off‐load to full production Reviews and analyses customer’s specifications and requirements in terms of material, process and assembly specification Initiates team discussion/review on customer document gaps/discrepancies and recommends proposals to customer Plans and generates detailed customer project activity timeline, tracks progress and anticipates potential issues, resolving them with internal stakeholders Ensures that customer indices are monitored and reviewed by having regular meet‐ups and review of team performance Develops and grows people project‐management skills, adopting to dynamic changes and crisis management Drives productivity improvement and cost reduction in process integration Works with TPM/Sales/customer for new design win and handles NPI engineering activities—reliability/yield and quality issue Requirements Degree/Diploma in Electrical/Electronics, Engineering or equivalent Minimum 3 years of engineering experience in the semiconductor manufacturing industry Preferably with Project Management Certification Knowledge of how bumping, assembly material interact with package workmanship and reliability would be preferred Knowledge on WLCSP bumping process of 2P2M; DOE/SPC/FMEA/JMP/APQP standard Bumping process knowledge on Lithography, Sputter, Etching, Plating, Descum & Ball drop process preferred #J-18808-Ljbffr


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