[Semiconductor] Process Manager

2 days ago

Singapore Ambition Full time

(Semiconductor Packaging) Process Manager

Role Overview

Lead and strategize 300mm bumping process engineering, ensuring high yield, quality, and process innovation. Collaborate with cross-functional teams to drive technical and operational excellence.

Key Responsibilities

  • Provide leadership and strategic direction for the bumping engineering team
  • Oversee development, optimization, and qualification of 300mm bumping processes
  • Execute technology roadmap and stay ahead of industry trends
  • Collaborate with manufacturing, quality, equipment engineering, and R&D teams
  • Manage personnel, equipment, and budget to meet departmental goals
  • Foster innovation and continuous process improvement
  • Identify and mitigate process risks to ensure production quality

Ideal Requirements

  • Bachelor's in Engineering, Physics, Materials Science, or related field
  • 10-12+ years experience in bumping engineering or 300mm wafer processing

Data provided is for recruitment purposes only. Only shortlisted candidates will be notified.

Business Registration Number: D | Licence Number: 10C5117 | EA Registration Number: R

If you would like to be considered for this opportunity, please forward a copy of your full CV to

Seniority level

  • Mid-Senior level

Employment type

  • Full-time

Job function

  • Engineering and Production

Industries

  • Semiconductor Manufacturing
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