Engineer, Advanced Package Metrology-Real-Time Defect Analysis

6 days ago


Singapore MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. Full time
Technology Development:
  • Develop and enable advanced package technology for various post-fab wafer finish and assembly processes
  • Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity
  • Integrate semiconductors while partnering with process and product engineering teams
Yield Improvement:
  • Achieve and improve yields through silicon package integration innovation, not limited to layout/design or process margin improvements
  • Collect and analyze data to provide actionable outcomes and decisions for layout, design, or integration flow changes
  • Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements
Quality Improvement:
  • Ensure defense coverage through process, measurement, inspection, and testing
  • Establish correlations between defense mechanisms to identify improvement opportunities
  • Conduct continuous data analysis to establish advanced controls and identify improvement opportunities
Collaboration and Coordination:
  • Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives
  • Work closely with various teams, including the PWF Engineering, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
  • Ensure smooth transition from new product development, qualification, small volume production to high volume production
  • Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product


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