
Application Process Engineer Semiconductor Assembly
7 days ago
(Job ID: )
Responsibilities:
- Develop advanced packaging technologies and processes for the assembly of high-density and high-performance electronic devices.
- Work closely with external customers and partners for technical support and joint development.
- Collaborate with internal R&D and product teams to develop new processes and products.
Requirements:
- Bachelor's or Master's degree in Mechanical Engineering, Material Science, Physics, or other relevant fields
- Hands-on experience in various semiconductor assembly equipment is preferred.
- Proficiency in using DOE tools to construct and conduct Design of Experiment (DOE) for various assembly process optimization.
- Familiarity with analytical equipment for failure mode analysis such as SEM/EDX, C-SAM, AFM, confocal microscope, surface profiler, high power optical microscope.
- Experience in semiconductor front-end/back-end process development is preferred.
- Experience using ANSYS or ABACUS to build models for stress and thermal simulation is an added advantage.
To apply, kindly send your updated resume to
We are regret that only shortlisted candidate will be notified.
However, rest assured that all applications will be updated to our resume
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