[Semiconductor Packaging] Bumping Process Manager

(Semiconductor Packaging) Process Manager Role Overview Lead and strategize 300mm bumping process engineering, ensuring high yield, quality, and process innovation. Collaborate with cross-functional teams to drive technical and operational excellence. Key Responsibilities Provide leadership and strategic direction for the bumping engineering...

Responsibilities:Line sustains for Bumping process and manage of shift associate engineerLead continuous improvement projects and device qualifications using APQP approachWork with Quality Management department to address customer inquiries and issuesExecute continuous Improvement Program or manage projects that contribute to improved yield & cost...

Responsibilities: Line sustains for Bumping process and manage of shift associate engineer Lead continuous improvement projects and device qualifications using APQP approach Work with Quality Management department to address customer inquiries and issues Execute continuous Improvement Program or manage projects that contribute to improved yield & cost...

Backend Packaging Process Quality ManagerWe are seeking a highly skilled Backend Semiconductor Packaging Process Engineer to join our team. The successful candidate will be responsible for developing and deploying inspection procedures to ensure conformance of material to be released.This is a challenging opportunity for a seasoned professional with...

(Semiconductor Packaging) Process Manager Role Overview Lead and strategize 300mm bumping process engineering, ensuring high yield, quality, and process innovation. Collaborate with cross-functional teams to drive technical and operational excellence. Key Responsibilities Provide leadership and strategic direction for the bumping engineering team Oversee...

Process Engineering Leadership OpportunityWe are seeking a skilled Process Manager to lead and strategize our 300mm bumping process engineering efforts. The ideal candidate will have a strong background in engineering, physics, or materials science, and at least 10 years of experience in bumping engineering or 300mm wafer processing.The successful candidate...

Job Description:">Lead and strategize 300mm bumping process engineering, ensuring high yield, quality, and process innovation.">Main Responsibilities:">">Provide leadership and strategic direction for the bumping engineering team">Oversee development, optimization, and qualification of 300mm bumping processes">Execute technology roadmap and stay ahead of...

Job DescriptionWe are seeking a highly skilled Bumping Process Optimization Expert to lead and strategize 300mm bumping process engineering. The successful candidate will ensure high yield, quality, and process innovation.Key Responsibilities:Provide leadership and strategic direction for the bumping engineering teamOversee development, optimization, and...

Role Overview: We are seeking a skilled NPI Engineer with strong expertise in wafer bumping processes to lead and manage customer and internal projects from initiation to production. This role is critical in driving new product introductions, ensuring process integration, and supporting cross-functional collaboration to meet technical and quality...

Job OverviewWe are seeking a highly skilled Backend Semiconductor Packaging Engineer to join our organization. The successful candidate will be responsible for developing and deploying inspection procedures to ensure conformance of materials to be released.Key ResponsibilitiesLead PQC engineers and inspectors in performing yield and product gating checks,...