
Assembly Packaging Engineer
2 weeks ago
Job Summary:
We are seeking an experienced engineer to develop advanced packaging technologies and processes for the assembly of high-density electronic devices.
This role requires collaboration with external customers and partners for technical support and joint development, as well as working closely with internal R&D teams to develop new products.
The ideal candidate has a Bachelor's or Master's degree in Mechanical Engineering, Material Science, Physics, or other relevant fields, with hands-on experience in various semiconductor assembly equipment.
Key Responsibilities:
- Develop and implement advanced packaging technologies and processes
- Collaborate with external customers and partners for technical support and joint development
- Work closely with internal R&D teams to develop new products
Requirements:
- Bachelor's or Master's degree in Mechanical Engineering, Material Science, Physics, or other relevant fields
- Hands-on experience in various semiconductor assembly equipment
- Proficient in using DOE tools to construct and conduct Design of Experiment (DOE) for various assembly process optimization
- Familiar with analytical equipment for failure mode analysis
- Experience in semiconductor front-end/back-end process development and using ANSYS or ABACUS to build models for stress and thermal simulation is an added advantage
About this Role:
This is an exciting opportunity for a talented engineer to join our team and contribute to the development of cutting-edge technologies. If you have a passion for innovation and a drive to succeed, we encourage you to apply.
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