Die Bonding Systems Engineer

Principal Engineer (Electrical) – Based in Malaysia Location: Pasir Gudang, Johor, Malaysia Responsibilities Develop and optimize bonding process parameters, including temperature, force, and time Troubleshoot process deviations and work with customers on R&D requirements Handle multi-tasks including Die Bonding, Wire Bonding, Optical alignment, and Rework...

Engineer (Die/Wire Bonding - Training Provided)Develop and optimize bonding process parameters, including temperature, force, and time. Troubleshoot process deviations and work with customers on R&D requirements. Work on Die Bonding, Wire Bonding, Optical Alignment, and Rework processes. Requirements Minimum Diploma in Electronics Engineering. Minimum 2...

Responsibilities: Develop and optimize bonding process parameters, including temperature, force, and time Troubleshoot process deviations and work with customers on R&D requirements Work on Die Bonding, Wire Bonding, Optical Alignment, and Rework processes Requirements: Minimum Diploma in Electronics Engineering Minimum 2 years of experience in an...

A leading electronics manufacturer in Singapore is looking for an experienced process technician to develop and optimize bonding process parameters. The role involves troubleshooting process deviations and collaborating with customers on R&D requirements. Ideal candidates should hold a diploma in Electronics Engineering and have at least 2 years of relevant...

Setup and operate assembly equipment for epoxy dispensing, die attach, wire bonding, plasma cleaning, epoxy curing, pull/shear testing, leak testing, etc. - Execute Design of Experiments (DOEs) to develop new assembly processes or improve existing ones. - Provide input to engineering teams on the producibility of new designs. - Help develop assembly...

Position title : TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages)Location: Admiralty Working Days: 5 Day A Week Working hours : 9:00am - 6:00pm Salary : $6000 - $8000 (depends experience)Role Overview We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor...

**Responsibilities**: - **R&D, design, and standardization of products; new technology implementation.** - **Collaborate with marketing/project teams to clarify design requirements.** - **Mechanical design (3D/2D modeling, simulation).** - **Coordinate with electrical engineers for component selection/layout.** - **Drawing review, process standardization,...

Head of Process Engineering – Thermo-Compression Bonder Systems PYXIS CF Pte Ltd is a Singapore-based developer of next-generation Thermo-Compression Bonder (TCB) systems for advanced semiconductor packaging, including HBM, CoWoS and 2.5D/3D heterogeneous integration. Our engineering programs are anchored in Singapore to support leading semiconductor...

About PYXIS CF PYXIS CF Pte Ltd is a Singapore-based developer of next‐generation Thermo‐Compression Bonder (TCB) systems for advanced semiconductor packaging, including HBM, CoWoS and 2.5D/3D heterogeneous integration. Our engineering programs are anchored in Singapore to support leading semiconductor manufacturers and global OSATs. We are expanding our...

**About GlobalFoundries**: **Summary of Role**: GlobalFoundries is seeking an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer t o drive thermal solutions for next-generation hybrid bonding development. **Essential Responsibilities**: - Lead 3DHI process development efforts for establishing thermal solutions required for advanced packaging...