Wire bond process development senior engineer

3 weeks ago


Singapore MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD Full time

Micron Packaging R&D group is looking for a highly talented individual for Wire Bond Process to develop innovative solutions for the Multi Chip Memory IC Packages. Job Responsibilities Provide leadership in wire bond technology, problem analysis and resolution. Develop and transfer wire bond process for IC Package process technology (Wire Bond) for multichip memory packages. Process development & characterization, qualification, and production pilot run. Work with a multi-functional team to characterize new Silicon technode and develop assembly packaging/recipe solutions for product requirements. Define, plan, and implement technology roadmap to meet wire bond packaging roadmaps. Qualify and transfer packaging technology to production site. Collaborate with other functional groups both locally and globally to develop wire bond solutions to meet the packaging business needs. Showcase and build organization reputation by publishing technical papers and submitting invention disclosures. Job Requirements Ph D/Master’s Degree in Materials, Chemical, Mechanical, Electrical & Electronic Engineering. At least 5 years of experience in semiconductor wire bond engineering. Good analytical and problem-solving skills, such as using Design Of Experiment and structured problem-solving tools. Self-motivated, able to work independently and possess a self-initiative personality. Possesses good communication skills, interpersonal skills, and the ability to work with global multi-functional teams. Keen on the role? Apply with us now #J-18808-Ljbffr



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