Backend Assembly Manufacturing Process Engineer Assistant
1 week ago
Company Overview
Micron is a leading provider of innovative memory and storage solutions. Our vision is to transform how the world uses information to enrich life for all.
We are passionate about using our expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible.
Our commitment to integrity, sustainability, and giving back to our communities fuels the very innovation we are pursuing.
Job Description
The Backend Assembly Manufacturing Process Engineer Assistant will learn on overall backend assembly operations and processes for semiconductor memory manufacturing.
This includes familiarization with systems and applications used in backend assembly manufacturing environments.
The ideal candidate will learn on wire bond process, wire bond defects & risk assessment for inline/OS deviation lot disposition.
They will also learn on factors that impact process quality and process limits & capabilities (CPK) to support process improvement evaluations.
Project Assignment
The successful candidate will work on a project to develop an effective method or solution based on wire bond defect Pareto to improve wire bond yield.
Deliverables
The incumbent must be able to understand backend assembly manufacturing requirements and operations.
They should be able to understand basic semiconductor memory devices functionality and operations.
The ideal candidate should be able to understand backend assembly manufacturing systems, applications, hardware, and processes.
They must be able to perform basic lot disposition according to defined specifications.
The project assignment must be completed within the timeline and meet project objectives and deliverables.
Estimated Salary Range: $65,000 - $85,000 per year
This estimate is based on industry standards and location-specific factors.
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