Yield & Process Integration Engineer

20 hours ago

Singapore Versatile Creation Sdn Bhd Full time

Job Responsibilities:

  • Focus on process yield engineering and bump process integration.

  • Collaborate with cross-functional teams to troubleshoot and resolve process-related issues observed during the wafer bumping process (both Dry and Wet), including the proposal and execution of Design of Experiments (DOEs).

  • Responsible to look into data analysis for yield and detect trend.

  • Lead continuous improvement projects & device qualifications using APQP approach.

  • Execute CIP (Continuous Improvement Program) or project handling that contributes yield & cost efficiency improvement.

  • Review and propose updates to calculated Statistical Process Control (SPC) limits to improve product quality and ensure process stability.

  • Take ownership of customer technical inquiries, perform detailed spec reviews, and lead the implementation of requirements for product offload transition from New Product Introduction (NPI) to mass production.

  • Overall coordinator of customer's initiated BKM exercise

Job Requirements:

  • Degree in Engineering.

  • Minimum 3 years of relevant experience preferably in the semiconductor industry.

  • Familiar with SPC, APQP, and data analysis tools.

  • Strong problem-solving and analytical skills.

Job Types: Full-time, Permanent

Pay: From $4,000.00 per month

Work Location: In person

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