Engineer, Advanced Packaging Wafer Level Technology Engineering
5 days ago
Key responsibilities and duties include:
Process Development:
- Establish and improve Wafer level process conditions and technologies (wafer thinning, backside metal interconnect)
- Upgrade process capabilities and reduce production costs
- Establish and improve process management projects to deliver technology node requirements and scaling for next node.
Equipment and Materials:
- Evaluate and promote new equipment and materials to enhance process capabilities
- Set up process parameters for a variety of semiconductor equipment
- Evaluate, promote, and plan for new equipment and materials
Quality Improvement:
- Ensure defense coverage through process, measurement, inspection, and testing
- Establish correlations between defense mechanisms to identify improvement opportunities
- Conduct continuous data analysis to establish advanced controls and identify improvement opportunities
Collaboration and Coordination:
- Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives
- Work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control
- Ensure smooth transition from new product development, qualification, small volume production to high volume production
- Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product
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Singapore Micron Technology Full timeOverview Principal/Senior Engineer, Advanced Packaging Wafer Level Technology Engineering at Micron Technology. Responsibilities Your responsibilities include but are not limited to developing and enabling deployment of processes related to the post-fab wafer finishing processes in semiconductor manufacturing to meet performance, cost, manufacturability,...
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