Director of Advanced Packaging Solutions

5 days ago

Singapore beBeeEngineering Full time

Job Title:

Senior Manager/Director

Job Description:

We are seeking a highly skilled Senior Manager/Director to lead our Advanced Package Engineering team in Singapore. As a key member of our organization, you will be responsible for providing 2.5D/3D engineering support for New Product Introduction (NPI) and High-Volume Manufacturing (HVM).

  • This role will oversee pilot and production lines to meet NPI and HVM product objectives and quality targets.
  • You will develop and manage plans based on project scope and resource requirements, while tracking metrics and budgets to ensure adequate support for staffing, equipment, and overall operational efficiency.

Key Responsibilities:

  • Lead the development and implementation of advanced package engineering strategies and processes.
  • Provide technical expertise and guidance to team members to ensure high-quality results.
  • Collaborate with cross-functional teams to identify and implement process improvements.
  • Develop and maintain relationships with internal stakeholders to ensure effective communication and collaboration.

Required Skills and Qualifications:

To be successful in this role, you will need:

  • A Business Degree preferably with post graduate Diploma in HR or its equivalent.
  • A track record of successful employee relations in a challenging environment, ideally gained in a production and customer service.
  • Bachelor's degree or higher in Materials, Electronics, Chemical, Physics, or Mechanical Engineering.
  • Minimum of 10 years of experience in semiconductor arena.
  • Working knowledge of 2.5D/3D Packaging Processes, Characterization, Qualification and HVM which are Sputtering, Lithography, Plating, Si Etch, CVD, CMP, AOI, Wafer Dicing, Backgrinding Chip Attach, TCB, Underfill, Wafer Mold processes.
  • Solid understanding of wafer FAB and Packaging processes and tools.
  • Technical benchmark, risk assessment & Product design guide.
  • Knowledge of Statistical Data Mining, FMEA, FA and Reliability.
  • Proficient in Microsoft Office, Jmp and CAD.

Tell Employers What You Have:

FMEA, Product Design, Physics, Wireless, Reliability, Research and Development, Data Mining, Characterization, Packaging, Engineering Support, Employee Relations, Manufacturing, CAD, Electronics, Mechanical Engineering

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