Lead W2W Bonding Scientist for Advanced 3D IC Packaging

A leading research agency in Singapore is seeking a W2W Bonding Research Scientist. This role involves developing advanced bonding techniques for semiconductor applications, optimizing parameters for high bonding strength, and conducting reliability tests. A PhD in relevant fields is necessary, along with experience in the W2W bonding process. The position...

W2W Bonding Research Scientist (APM), IME Join to apply for the W2W Bonding Research Scientist (APM), IME role at A*STAR - Agency for Science, Technology and Research . Research scientists working on the wafer-to-wafer (W2W) bonding process are primarily responsible for developing, optimizing, and integrating advanced hybrid bonding techniques for...

Research scientists working on the wafer-to-wafer (W2W) bonding process are primarily responsible for developing, optimizing, and integrating advanced hybrid bonding techniques for semiconductor applications like 2.5D and 3D IC packaging. Job Description Research and Development Process Innovation: Leading the design and development of innovative W2W bonding...

Research scientists working on the wafer-to-wafer (W2W) bonding process are primarily responsible for developing, optimizing, and integrating advanced hybrid bonding techniques for semiconductor applications like 2.5D and 3D IC packaging. Job Description Research and Development Process Innovation : Leading the design and development of innovative W2W...

A research scientist working on Chip-to-Wafer (C2W) bonding processes primarily focuses on the development, optimization, characterization, and integration of advanced bonding techniques for semiconductor packaging and heterogeneous integration applications. Job Description Process Development and Optimization Innovate and develop new C2W bonding...

Overview Scientist (Heterogeneous Integration), IME The Heterogeneous Integration Department at the Institute of Microelectronics (IME) is seeking a passionate and skilled Principal Scientist to join our team. This role is pivotal in advancing state-of-the-art chip-to-wafer and wafer-to-wafer hybrid bonding processes, developing cutting-edge fabrication...

Scientist/Senior Scientist – Process Integrator / Hybrid Bonding/ Heterogeneous Integration The Heterogeneous Integration Department at the Institute of Microelectronics (IME) is seeking a passionate and skilled Principal Scientist to join our team. This role is pivotal in advancing state-of-the-art chip‐to‐wafer and wafer‐to‐wafer hybrid bonding...

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Senior Scientist (Far BEOL – Advanced Process Modules), IME Responsibilities Develop Chip-to-Wafer (C2W) bonding process capabilities using fusion, hybrid, thermocompression, and eutectic bonding for photonics heterogeneous integration and advanced packaging applications. Lead module loop integration for layer

A leading research institution in Singapore is seeking a Principal Scientist to advance hybrid bonding processes for 2.5D and 3D applications. The role involves collaborating with senior staff, leading impactful projects, and contributing to groundbreaking technologies in semiconductor fabrication. Ideal candidates have a PhD and experience in...