Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering
5 days ago
Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
Micron’s vision is to transform how the world uses information to enrich life for all.
Join a world-class global team focused on one thing: using our expertise in the relentless pursuit of innovation to enable high value technology driven solutions for customers and partners. The solutions we create help make everything from virtual reality experiences to breakthroughs in supercomputing and artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can spark the very innovation we are pursuing.
We are currently experiencing a transformative period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and
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Singapore Micron Technology Full timeJoin to apply for the Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering role at Micron Technology 6 days ago Be among the first 25 applicants Join to apply for the Principal/Senior/ Engineer, Advanced Packaging Die Level Technology Engineering role at Micron Technology Our vision is to transform how the world uses information...
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Singapore beBeeEngineering Full time $90,000 - $120,000Advanced Packaging Die Level Technology EngineeringWe are seeking a skilled Engineering professional to join our team.Design, develop, and implement advanced packaging solutions for die-level technologyCollaborate with cross-functional teams to deliver high-performance memory productsStay up-to-date with industry trends and advancements in memory and compute...
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Singapore Micron Full time**Our vision is to transform how the world uses information to enrich life for all.** Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it...
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Singapore beBeePackaging Full time $90,000 - $120,000Job DescriptionWe are seeking a highly skilled and motivated professional to join our team as an Advanced Packaging Die Level Technology Engineer. In this role, you will be responsible for developing and implementing advanced packaging technologies to meet the demands of high-performance memory products.The ideal candidate will have a strong background in...
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