Packaging Innovation Specialist

2 days ago


Singapore beBeePackaging Full time $80,000 - $120,000
Lead Packaging Integration Engineer

We are seeking a skilled engineer to spearhead the integration of advanced packaging processes, focusing on die-to-wafer (D2W) and wafer-to-wafer (W2W) bonding solutions for ultra-low power (ULP) CMOS platforms.

This role encompasses the development of innovative process solutions from early stages through to manufacturing, ensuring seamless execution and collaboration within cross-functional teams.



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