Senior Director, Packaging Engineering

7 days ago


Singapore MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. Full time

Estimated Salary: SGD $180,000 - SGD $250,000 per annum

About Micron Semiconductor Asia Operations PTE. LTD.

We are a leading semiconductor company dedicated to delivering innovative memory and storage solutions. Our team is passionate about pushing the boundaries of technology and creating a brighter future for our customers and partners.

Sr/Manager, Advance Packaging Job Description

We are seeking an experienced Sr/Manager, Advance Packaging to lead our Advanced Packaging team. The successful candidate will be responsible for driving the overall strategy and direction of our Advanced Packaging process, equipment, and materials definition, development, and optimization.

Key Responsibilities:
  • Develop and implement high-performing teams.
  • Establish department objectives aligned to company strategic objectives and goals.
  • Prioritize objectives, remove barriers, and drive accountability.
  • Establish job responsibilities, performance goals, and development goals for direct reports.
  • Provide ongoing performance feedback and conduct regular performance appraisals for direct reports.
  • Optimize department performance and structure by monitoring and overseeing department performance achievements and providing timely interventions.
  • Coach, mentor, and develop current and future Micron leaders by assessing talent and developing talent management strategies.
  • Support learning opportunities within the department and plan development opportunities for direct reports.
  • Provide consultation or implement timely interventions to prevent or resolve conflicts with minimal noise.
  • Establish strategies to provide and support recognition.
  • Promote and oversee partnerships across functional areas and customer groups.
Requirements:
  • Bachelor's or Master's in Electrical Engineering, Materials Science, Chemical Engineering, or related field.
  • 8 or more years of experience in Semiconductor Manufacturing on leadership capacity, with a proven track record of technical leadership in semiconductor manufacturing, with expertise in Front End, PWF, HBM technology, process development, and/or equipment management.
  • Strong leadership and vision, with the ability to comfortably work across organizational boundaries and geographies.
  • Demonstrated ability to influence executives, senior leaders, and partners on strategic decisions across multiple functions and geographies.
  • Ability to effectively collaborate with cross-functional organizations to understand needs and translate them into actionable plans, deliverables, and resource requirements.


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