Lead IC Packaging Engineer
5 days ago
Senior Mechanical Engineer
OverviewWe are seeking an experienced Senior Mechanical Engineer to join our team at UTAC HEADQUARTERS PTE. LTD. as a Lead IC Packaging Engineer specializing in thermal analysis and design.
SalaryThe estimated annual salary for this position is $120,000-$180,000, depending on qualifications and experience.
About the RoleIn this role, you will be responsible for performing advanced mechanical and thermal analysis of IC packages, building new capabilities with latest simulation technologies, and designing packages that meet customer specifications.
Key Responsibilities- Conducting mechanical and thermal characterization of IC packages using simulation software such as Ansys and Abaqus.
- Developing new packaging assembly and process technologies to improve mechanical and reliability performance.
- Collaborating with other teams to conduct IC packaging technology development.
- Evaluating the feasibility of new technologies using simulation and testing methods.
- M.Sc. or Ph.D. in Mechanical Engineering or related field.
- Strong knowledge of finite element methods (FEM) and mechanics of materials.
- Experience with mechanical modeling for stress and warpage analysis, drop test, and TCOB testing using simulation software.
- Prior experience in thermo-mechanical modeling for IC assembly molding processes is a plus.
- Reliability testing experience, including drop test, TCOB test, warpage measurement, bending test, and material strength testing.
- Thermal modeling experience using CFD software like Flotherm or Icepak is highly desirable.
- Excellent communication and interpersonal skills.
- A passion for R&D activities in IC packaging technology development.
- A competitive salary range of $120,000-$180,000 per annum.
- A dynamic and supportive work environment.
- The opportunity to work on cutting-edge IC packaging technologies.
- Ongoing professional development and training opportunities.
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