Backend Process Engineer for IC Packaging

2 days ago


Singapore SILICON BOX PTE. LTD. Full time
Job Title: Backend Process Engineer for IC Packaging

We are seeking a skilled Backend Process Engineer to join our team at Silicon Box PTE. LTD.

About the Role:

This is an exciting opportunity to work in the semiconductor manufacturing industry, where you will be responsible for developing and establishing production processes for Backend operations including Pick and Place, SMT and SMD, Ball Drop, Reflow, Laser Marking, Tape and Reel, Singulation, Packing, and AOI.

About You:

To succeed in this role, you will need a minimum bachelor's degree in material science, microelectronics, mechanical engineering, or a relevant engineering field, with experience in semiconductor manufacturing industry and working in cleanroom environment. Additionally, hands-on process experience in Backend Process: Pick and Place, SMT and SMD, Ball Drop, Reflow, Laser Marking, Tape and Reel, Singulation, Packing, AOI, etc., within semiconductor IC packaging industry is essential.

Responsibilities:
  • Develop and establish production processes for Backend operations.
  • Troubleshoot process issues and improve process capabilities, yield, and cycle time from customer NPI stage to LVM/HVM stage.
  • Lead and drive SPC control, review and maintain FMEA, Control plan, OCAP with cross-functional teams.
  • Handle and manage customer audits and 8D reports.
  • Provide disposition for engineering and production lots.
  • Conduct process characterization and qualification to establish process baseline.
  • Coordinate and liaise with vendors/suppliers on process issues or quality issues.
  • Support customer NPI activities and internal engineering activities.
  • New material, process, and machine development and qualification.
Requirements:
  • Minimum bachelor's degree in material science, microelectronics, mechanical engineering, or relevant engineering field.
  • Experience in semiconductor manufacturing industry and working in cleanroom environment.
  • Hands-on process experience in Backend Process: Pick and Place, SMT and SMD, Ball Drop, Reflow, Laser Marking, Tape and Reel, Singulation, Packing, AOI, etc., within semiconductor IC packaging industry.
  • Experience in SPC, DPE, FMEA, OCAP, WI, CPK, PPK, 4D/8D report.
What We Offer:

We offer a competitive salary range of SGD $80,000 - $120,000 per annum, depending on experience, as well as opportunities for professional growth and development.


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