Senior Engineer, Advanced Packaging FEOL

4 weeks ago


Singapur, Singapore Micron Full time
Transforming the Future of Information

At Micron, we're driven by a vision to revolutionize how the world uses information to enrich life for all. As a Sr. Engineer, PDE Advanced Packaging FEOL, you'll be part of an inclusive team passionate about harnessing their expertise in the relentless pursuit of innovation for customers and partners.

Key Responsibilities:
  • Identify and evaluate new equipment and technologies to support current and future requirements for FEOL area
  • Develop and establish new equipment design and capability requirements aligned to Process and Packaging Roadmap
  • Collaborate with equipment suppliers to develop new capabilities
  • Engage in active participation in Package Development Engineering activities
  • Conduct equipment benchmarking to establish equipment suppliers and platforms for future needs
  • Create decision matrices for equipment and material selection
  • Install and qualify new equipment platforms and hand over to production groups
  • Plan and submit capital requests to acquire new equipment
  • Establish project handover requirements and procedures upon machine qualification
Requirements and Qualifications:
  • PhD/Masters/Bachelor's Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
  • Basic knowledge in semiconductor manufacturing assembly & wafer bumping packaging technologies & techniques
  • Minimum 2 years' experience in related semiconductor industry
  • Experience with technical knowledge on assembly and/or wafer bumping packaging technology
  • Advantage packaging technology and Front end of line background will be preferable and plus point
  • Understanding and/or experience in equipment automation solution GEM300, AMHS and IIOT solution for datamation such as APC, FDC, E3, PCS, SPC) is a plus

We're looking for a fast learner with initiative and independence, a good team player with strong communication and presentation skills, and a strong understanding of business needs and customers' requirements. If you're passionate about innovation and have a strong background in packaging technology, we'd love to hear from you.



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