Senior Engineer, Advanced Package FEOL

1 month ago


Singapur, Singapore Micron Full time
Transforming Information for a Better World

At Micron, our vision is to revolutionize how the world uses information to enrich life for all.

Key Responsibilities
  • Identify and evaluate new processes, equipment, and technologies to support current and future requirements for the FEOL area.
  • Develop and establish new process, equipment design, and/or capability requirements aligned to the Process and Packaging Roadmap.
  • Collaborate with equipment suppliers to develop new capabilities.
  • Actively participate in Package Development Engineering activities.
  • Conduct equipment benchmarking to establish equipment suppliers and platforms for current and future needs.
  • Create decision matrices for equipment and material selection.
Installation and Qualification
  • Plan and submit capital requests to acquire new equipment.
  • Create purchasing specifications (Doc2) documents.
  • Establish new equipment qualification criteria and activities roadmaps with respective functional teams.
  • Establish project handover requirements and procedures upon machine qualification.
  • Prepare documentation for handover with respective site owners.
  • Conduct data gathering for low-volume production.
  • Conduct training for site representatives and personnel.
  • Establish feedback loops for Continuous Improvement after mass-volume production.
Defining and Maintaining Key Equipment Capabilities
  • Maintain and regularly update the TOR (Tool of Records) with inputs from local or other assembly sites.
  • Maintain general knowledge of process and material characteristics and translate to equipment design requirements.
  • Search continually for new equipment or suppliers with improved or new capabilities aligned to Process/Packaging needs.
Collaboration and Continuous Improvement
  • Maintain knowledge of design constraints and weaknesses of existing platforms.
  • Participate in continuous improvement projects involving equipment improvement and upgrades.
Requirements and Qualifications
  • PhD, Masters, or Bachelors Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics, or equivalent work experience required.
  • Basic knowledge in semiconductor manufacturing assembly & wafer bumping packaging technologies & techniques.
  • Minimum 2 years' experience in related semiconductor industry.
  • Experience with technical knowledge on assembly and/or wafer bumping packaging technology.
  • Advantage packaging technology and Front-end of line background will be preferable and a plus.
  • Understanding and/or experience in equipment automation solutions (GEM300, AMHS, IIOT) and data management solutions (APC, FDC, E3, PCS, SPC) is a plus.
  • Fast learner with initiative and independence (minimum supervision).
  • Good team player with ability to integrate and cooperate with cross-functional teams and external vendors.
  • Strong communication and presentation skills.
  • Understanding of business needs and customers' requirements.
  • Strong project management skills to ensure execution to timelines.


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