Senior Chip Packaging Engineer
2 weeks ago
We are working with a design company, and as part of their continued growth, NodeFlair has been engaged to search for Senior Chip Packaging Engineer to join their Singapore team.
The package is competitive at SGD 84k - 126k / year (excluding bonus).
Responsibilities:
Requirements:
- Bachelors or higher in Electronic Engineering, Microelectronics, Computer Science, or related field.
- 5+ years in packaging design or project development.
- Strong communication, coordination, and teamwork skills.
- English and Chinese proficiency is a plus.
Interested applicants, please contact Ayla at ayla@nodeflair.com for a confidential discussion.
EA License No: 19S9830
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