Technical Assembly Process Engineer
1 day ago
The Technical Assembly Process Engineer will be responsible for ensuring the successful execution of assembly process development for new products and packages. This includes delivering BIC yield and cost on product NPI with integration of DFx BIC package solution, process guideline, and design rules.
In this role, you will collaborate with multi-functional teams from NPI to LVM/HVM process transfer, and lead defect elimination and continuous improvement actions using problem-solving methodologies, statistical analysis, and integrated solutions.
You will also participate in technology enablement and development - process, material, equipment - by engaging with suppliers and participating in supplier roadmaps to understand market trends and competitor direction.
Key Responsibilities:- Execute assembly process development for new products and packages
- Collaborate with multi-functional teams for process transfer
- Lead defect elimination and continuous improvement actions
- Participate in technology enablement and development
To succeed in this role, you must have a strong background in engineering, leadership experience or potential, and experience in projects during internships. Additionally, you should showcase critical thinking skills, a keen interest in the semiconductor industry, and great teamwork abilities.
A bachelor's or master's degree in engineering is required, and you should be proficient in hardware, software, semiconductor design, or telecomm engineering assignments.
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