Assembly Process
4 days ago
- You are responsible to drive and manage the silicon Bump & package assembly suppliers, backend processes and solutions to achieve the aggressive TQRDCEB goals.
- You will work closely with package design & technology, test & product engg, production planning, quality engg & NPI teams, assembly/substrate suppliers to support new product & technology introduction activities by defining processes, monitoring systems, manage process improvements and changes.
- Provide day-to-day support to bump and assembly suppliers & internal planning, product and test engineering teams.
- Plan, drive & implement improvement activities for continual improvement, 2nd sourcing, cost reduction & customer satisfaction.
- PhD / Master / Degree in Mechanical / Electrical / Electronics Engineering with 7~12 years of relevant experience of managing advanced node silicon bumping, large body single & multi-chip (2.1/2.5/3D) package assembly, substrate & back-end suppliers and processes.
- Hands on experience in Product Life-Cycle Management - creating & maintaining Bill of Material structure, Process Documentation, Process Change Notification etc.
- Good team player, result oriented individual, experienced in project management, failure analysis tools, techniques and TQM. Good analytical, problem-solving skills. Flexible and agile.
- Sound knowledge of applicable industry standards, quality systems, regulations, knowledge of prevailing and emerging silicon package & substrate technologies, bumping and assembly processes, materials and equipment.
- Able to communicate with internal team members & external partners in various geographic locations and may required to travel from time to time at short notice.
- Experienced AutoCAD user. Knowledge of silicon & PCB fabrication, board assembly processes, are an added advantage
Tell employers what skills you have
Production Planning
Test Engineering
Agile
Product Lifecycle Management
Electrical
Fabrication
TQM
Project Management
Assembly Processes
AutoCAD
Assembly
Silicon
Electronics
Failure Analysis
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