Advanced Manufacturing Specialist

7 days ago

Singapore beBeePackaging Full time $90,000 - $120,000

Senior Packaging Leadership Opportunity

About the Role:

This senior leadership position oversees advanced package engineering in Singapore. The role will lead and manage a team of engineers to drive product introduction and manufacturing, tailored to regional operations needs.

Key Responsibilities:

  • Provides 2.5D/3D engineering support for product introduction and manufacturing, tailored to regional operations needs.
  • Oversees pilot and production lines to meet product objectives and quality targets.
  • Manages program schedules and achievements.
  • Determines what needs to be done and shares innovative solutions to achieve policies and objectives.
  • Solves complex problems using multiple approaches.
  • Develops short-term and long-term strategic plans.

Requirements and Qualifications:

  • Bachelor's degree or higher in Materials, Electronics, Chemical, Physics, or Mechanical Engineering.
  • 10 years of experience in semiconductor arena.
  • Expertise in 2.5D/3D packaging processes, characterization, qualification, and high-volume manufacturing.
  • Solid understanding of wafer fabrication and packaging processes.
  • Knowledge of statistical data mining, failure mode and effects analysis, and reliability.
  • Proficient in Microsoft Office, Jmp, and CAD software.

As a senior packaging leader, you will be responsible for driving innovation and excellence in our packaging engineering team. You will oversee advanced package engineering in Singapore and lead a team of engineers to drive product introduction and manufacturing tailored to regional operations needs.

We are looking for a seasoned professional with a strong background in materials science and engineering. You must have at least 10 years of experience in the semiconductor industry and expertise in 2.5D/3D packaging processes, characterization, qualification, and high-volume manufacturing.

Responsibilities include providing 2.5D/3D engineering support for product introduction and manufacturing, overseeing pilot and production lines to meet product objectives and quality targets, managing program schedules and achievements, determining what needs to be done and sharing innovative solutions to achieve policies and objectives, solving complex problems using multiple approaches, and developing short-term and long-term strategic plans.

Requirements include a bachelor's degree or higher in materials, electronics, chemical, physics, or mechanical engineering, 10 years of experience in the semiconductor arena, expertise in 2.5D/3D packaging processes, characterization, qualification, and high-volume manufacturing, solid understanding of wafer fabrication and packaging processes, knowledge of statistical data mining, failure mode and effects analysis, and reliability, and proficiency in Microsoft Office, Jmp, and CAD software.

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