
Senior Packaging Engineer
2 weeks ago
Transforming the Future of Memory Technology
Packaging Wafer Level Expertise RequiredWe are currently experiencing a transformative period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies.
High bandwidth memory (HBM) is at the forefront of these innovations. Our team is responsible for delivering package development for high performance memory products.
The ideal candidate will possess expertise in wafer level packaging technology, with a strong understanding of Chemical Mechanical Planarization (CMP) and grinding processes.
About the Role:
- Packaging Wafer Level Technology Expertise
- Chemical Mechanical Planarization (CMP) / Grinding Experience
- Strong Understanding of High Bandwidth Memory (HBM) Technologies
Benefits:
- Collaborative and dynamic work environment
- Opportunities for career growth and professional development
- Competitive salary and benefits package
Others:
We are committed to fostering a culture of innovation, integrity, and sustainability. Our solutions enable high value technology driven applications for customers and partners. Join us in shaping the future of memory technology.
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