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Senior Process Development Engineer
3 weeks ago
We are seeking a skilled Process Development Engineer to support TD activities associated with rapid deployment of technology nodes, process margin improvement work necessitated thereof as well as ensuring extended engagement with manufacturing on upcoming technology nodes.
The selected candidate will be responsible for process module ownership involving Bonding/Grind/Trim process characterization and advanced process development for 3D NAND and beyond.
Key responsibilities include working with process development engineers in Singapore and Boise, US TD site and vendors to develop processes that meet integration requirements for next-generation 3D NAND nodes.
Transfer of Bonding/Grind/Trim processes to high volume manufacturing (Fab10) and continuous improvements to manufacturability is also required.
Candidates must address process issues working with Fab10 team and key business partners on tool choices for manufacturing, evaluations etc. as applicable.
A focus on understanding and improving the process margins required for meeting mature yield goal for 3D NAND parts is essential.
Advanced 3D NAND Bonding/Grind/Trim process development includes performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications.
In this role, you will initiate and manage experiments to widen process margins as well as test out manufacturability of next node solutions.
You will identify process simplification opportunities and drive cross-functional teams in implementation.
Incorporating best-known manufacturing methods into early development phase of upcoming nodes is crucial.
Designing and implementing advanced process monitoring and control methodologies is also key.
Requirements:- Bachelor's degree or higher in Materials Science, Chemical Engineering or Physics with minimum 2 years hands-on experience in leading-edge Bonding/Grind/Trim equipment.
- Familiarity with Bonding/Grind/Trim equipment operation, optical metrology and profilometry.
- In-depth understanding of Bonding/Grind/Trim process mechanisms.
- Understanding of various integration and structural impacts and constraints related to Bonding/Grind/Trim process.
- An understanding of general process steps and process flow for memory processing, planar and vertical NAND memory in particular.
- Working knowledge of data analysis systems e.g.: Y3 to facilitate analysis of experimental data.
- Working knowledge of Design of Experiments (DoE).
- Proven ability to collaborate with local and overseas teams on projects.
- Excellent oral and written communication skills with ability to convey message in concise and effective manner both in local as well as remote communications.
- Ability to be self-motivated individual and be adaptable to changing needs in terms of working extended hours, if required.
- Proven ability to work in demanding & dynamic environment and able to prioritize and manage multiple projects simultaneously.
Seniority level: Entry level
Employment type: Full-time
Job function: Other
Industries: Computer Hardware Manufacturing, Appliances, Electrical, and Electronics Manufacturing, and Semiconductor Manufacturing
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