High-Bandwidth Memory Design Lead
1 week ago
We are seeking an experienced professional to lead the development and validation of next-generation high-bandwidth memory (HBM) products.
The successful candidate will be responsible for ensuring optimized test coverage on current and future HIG HBM design architectures and process nodes, as well as developing and validating Micron's next-generation HBM products to ensure reliability and market readiness.
Key Responsibilities- Optimize test coverage on current and future HIG HBM design architectures and process nodes to maintain effectiveness and efficiency in high-volume manufacturing.
- Develop and validate Micron's next-generation HBM products to ensure reliability and market readiness.
- Provide design verification support and in-depth circuit analysis using CAD tools and Verilog simulations.
- Improve manufacturing test yields (including device issues from DRAM, Interface, and Stacked Die yield), reduce test time, and resolve yield-related issues.
- Promote innovation and drive changes that provide Micron with a technical advantage.
- Mentor team members and actively develop their skills.
- Project manage efficient execution and timely delivery of solutions.
- Make final decisions on risk analysis and project prioritization.
- Collaborate with cross-functional teams to ship end products.
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Singapore Micron Technology Full timeProduct Integration Lead, HIG High Bandwidth Memory Join to apply for the Product Integration Lead, HIG High Bandwidth Memory role at Micron Technology Product Integration Lead, HIG High Bandwidth Memory 1 week ago Be among the first 25 applicants Join to apply for the Product Integration Lead, HIG High Bandwidth Memory role at Micron Technology Our vision...
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