Senior Module Designer

2 weeks ago

Singapore beBeeThermalBonding Full time $80,000 - $120,000

Job Title: Thermal Bonding Specialist

We are seeking a skilled Thermal Bonding Engineer to join our team. As a key member of our organization, you will play a critical role in designing, developing and optimizing thermal bonding modules used in advanced semiconductor packaging.

  • Design and Development: Design innovative thermal bonding module assemblies for chip-to-wafer or chip-to-substrate bonding.
  • Responsible for 3D design and 2D drawings, BOM management, FMEA, error budgeting, Design for Manufacturability and Assembly (DFMA).
  • Planning, Scheduling and Costing of Machines Modules: Plan, schedule and cost machines modules for thermal bonding equipment.
  • Prototyping and Testing: Oversee fabrication of prototype modules and their integration with thermal bonding platforms.
  • Analyze test results, identify design improvements and troubleshoot failures related to temperature non-uniformity, inefficiency or material degradation.
  • Collaborate with electrical, vision and software engineers for machine integration.
  • Collaborate with process team to improve the bonding machine (e.g., bonder heads, stages, temperature/power controls).
  • Collaborate with manufacturing engineers to ensure DFMA and safe, robust assembly of module systems.

This role requires strong technical skills, excellent communication and collaboration abilities, and a passion for delivering high-quality solutions.

In return, you can expect a dynamic work environment, opportunities for growth and development, and a competitive compensation package.

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