Principal Process Integration Specialist

6 days ago


Singapore MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. Full time

Join our team at Micron Semiconductor Asia Operations PTE. LTD. and be part of an innovative organization that drives strategic packaging initiatives critical to our future.

We are seeking a highly skilled Principal Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team and contribute to the development of innovative packaging solutions that drive business growth and customer satisfaction.

Responsibilities:

  • Collaborate with process and design teams to develop and transfer technology, ensuring seamless integration and efficient product development.
  • Design and tape out reticles, develop process flows, and secure resources, including wafers and processes, to meet yield and performance goals.
  • Analyze data to provide actionable outcomes for layout, design, or integration flow changes, driving continuous improvement and optimization.
  • Work closely with Probe, Yield Analysis, Test, and Reliability Engineering teams to achieve and improve yields impacted by design limitations.
  • Ensure critical work, achievements, and goals are met while guiding resource utilization and optimizing workflows.

Qualifications:

  • Master's degree in Electrical, Mechanical, Computer Engineering, Chemistry, Physics, Materials, or related field.
  • 10 years of experience in Process Integration/Development or Package Integration within the semiconductor industry.
  • Strong architectural sense to translate process/design into technical requirements and specifications.
  • Expertise in data extraction, analysis, and reporting tools such as JMP, Python, R.
  • In-depth understanding of process flows, interactions, and their effects on yield, performance, and reliability.
  • Technical knowledge and experience in Ultra-Thin Die Integration, Thermal Compression Bonding, Die to wafer, and Gap fill technology in a semiconductor environment.
  • Experience in various assembly processes like Dicing, Thinning, Molding with expertise in Package Characterization and Process Metrology Memory Technology Integration of NAND and or DRAM including 3D Architectures.

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