Wafer Singulation

Company:Qualcomm Asia Pacific Pte. Ltd.Job Area:Engineering Group, Engineering Group > Hardware EngineeringGeneral Summary:Job DescriptionJoin this team focused on RF Front End Modules for the Cellular and Wireless Data markets. You will be part of the Business Unit Engineering organization, working closely with Design, Test, NPI Planning, Program...

RF360 SINGAPORE PTE. LTD. is seeking a hands-on Process Engineer to support backend semiconductor packaging operations, focusing on wafer bumping, singulation, grinding, and mounting. You will provide day-to-day engineering support to meet production goals. The role emphasizes data-driven problem solving, continuous improvement, and close collaboration with...

Job Summary: We are seeking a motivated and hands-on Process Engineer to support backend semiconductor packaging operations, with primary focus on wafer bumping, wafer singulation, wafer grinding/backgrind, and wafer mounting processes. The successful candidate will provide day-to-day engineering support to meet production output, product quality,...

Company:RF360 Singapore Pte., Ltd.Job Area:Engineering Group, Engineering Group > Hardware EngineeringGeneral Summary:Description:Join this team focused on RF Front End Modules for the Cellular and Wireless Data markets. You will be part of the Business Unit Engineering organization, working closely with Design, Test, NPI Planning, Program Management,...

Job SummaryThe Packaging & Testing Engineer supports translational semiconductor research by bridging advanced packaging process development with industry-relevant manufacturing practices. The role focuses on operational engineering control of back-end processes—including backgrinding, wafer dicing, molding, and package-level testing—within a research...

Summary We live in a mobile and device driven world where knowledge of the physical world around us is needed. We rely on this knowledge to get around, to learn about our environment and to enable spectacular new features for custom applications. Apple is meeting those needs as robustly and as creatively as possible and is interested in people who want to...

STATS CHIPPAC MANAGEMENT PTE. LTD. is seeking a process engineer to develop, optimize, and stabilize wafer/package separation processes such as Laser Grooving, Stealth Dicing, and Blade Dicing in advanced semiconductor packaging. You will lead DOE studies, implement statistical tools (JMP), and drive yield improvements and robust solutions for production....

About the roleDevelop, optimize, and stabilize wafer/package separation processes, including Laser Grooving, Stealth Dicing, Blade Dicing, and Molded Wafer Singulation, for advanced semiconductor packaging. Drive process readiness, yield improvement, robustness, and customer-specific technical solutions toward production. Key responsibilitiesDevelop and...

Company:RF360 Singapore Pte., Ltd.Job Area:Engineering Group, Engineering Group > Hardware EngineeringGeneral Summary:Description:Join this team focused on RF Front End Modules for the Cellular and Wireless Data markets. You will be part of the Business Unit Engineering organization, working closely with Design, Test, NPI Planning, Program Management,...