Wafer Singulation

Company:RF360 Singapore Pte., Ltd.Job Area:Engineering Group, Engineering Group > Hardware EngineeringGeneral Summary:Description:Join this team focused on RF Front End Modules for the Cellular and Wireless Data markets. You will be part of the Business Unit Engineering organization, working closely with Design, Test, NPI Planning, Program Management,...

Company:Qualcomm Asia Pacific Pte. Ltd.Job Area:Engineering Group, Engineering Group > Hardware EngineeringGeneral Summary:Job DescriptionJoin this team focused on RF Front End Modules for the Cellular and Wireless Data markets. You will be part of the Business Unit Engineering organization, working closely with Design, Test, NPI Planning, Program...

Company:RF360 Singapore Pte., Ltd.Job Area:Engineering Group, Engineering Group > Hardware EngineeringGeneral Summary:Description:Join this team focused on RF Front End Modules for the Cellular and Wireless Data markets. You will be part of the Business Unit Engineering organization, working closely with Design, Test, NPI Planning, Program Management,...

Company:RF360 Singapore Pte., Ltd.Job Area:Engineering Group, Engineering Group > Hardware EngineeringGeneral Summary:Description:Join this team focused on RF Front End Modules for the Cellular and Wireless Data markets. You will be part of the Business Unit Engineering organization, working closely with Design, Test, NPI Planning, Program Management,...

RF360 SINGAPORE PTE. LTD. is seeking a hands-on Process Engineer to support backend semiconductor packaging operations, focusing on wafer bumping, singulation, grinding, and mounting. You will provide day-to-day engineering support to meet production goals. The role emphasizes data-driven problem solving, continuous improvement, and close collaboration with...

Job Summary: We are seeking a motivated and hands-on Process Engineer to support backend semiconductor packaging operations, with primary focus on wafer bumping, wafer singulation, wafer grinding/backgrind, and wafer mounting processes. The successful candidate will provide day-to-day engineering support to meet production output, product quality,...

About us STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving...

Job SummaryThe Packaging & Testing Engineer supports translational semiconductor research by bridging advanced packaging process development with industry-relevant manufacturing practices. The role focuses on operational engineering control of back-end processes—including backgrinding, wafer dicing, molding, and package-level testing—within a research...

Summary We live in a mobile and device driven world where knowledge of the physical world around us is needed. We rely on this knowledge to get around, to learn about our environment and to enable spectacular new features for custom applications. Apple is meeting those needs as robustly and as creatively as possible and is interested in people who want to...