Product Packaging Engineer

Found in: Talent SG 2A C2 - 1 week ago


Singapore INTEL TECHNOLOGY ASIA PTE LTD Full time
Roles & Responsibilities

Job Description

Intel's announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. The external Packaging and Assembly Engineering team (EPAE) will play a critical role in this strategy, leveraging external assembly technologies to deliver leadership products.

Seeking a motivated candidate for the New Product Introduction team which will work with the external assembly suppliers to qualify Intel's products that meet the cost, quality and timeline requirements. Flawlessly execute the product NPIs by timely managing the tasks and resolving issues with close collaboration with the product BU partners, platform management and manufacturing teams.


In addition, a successful candidate will demonstrate:

  • Knowledge of supply chain business processes and OSAT
  • Knowledge of product NPI development process
  • Knowledge in project management
  • Knowledge of assembly processes and substrate fabrication processes
  • Understanding of reliability failure modes in semiconductor processing and electronic packaging, inclusive of die to package interaction failures.
  • Excellent problem solving, communication and presentation skills.


Qualifications


Minimum qualifications:

  • Candidate must possess a Master's Degree in Electronic Engineering, Physics, Material Science, chemical engineering r related field of study.
  • 6+ years of experience in semiconductor industry.


Preferred qualifications:

  • Experience working on new product introductions, in particular in assembly
  • Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Tell employers what skills you have

Leadership
Semiconductor Industry
Physics
Supply Chain
Problem Solving
Fabrication
Reliability
Project Management
Packaging
Semiconductors
Presentation Skills
Assembly Processes
Assembly
Manufacturing
Chemical Engineering

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