senior engineer, pde package silicon integration

2 weeks ago

Singapur, Singapore Micron Full time

Join us in our mission to revolutionize how information is utilized to enhance the quality of life for everyone.

Come be part of an inclusive team dedicated to one common goal: leveraging their expertise to drive constant innovation for clients and partners. The solutions we create enable everything from immersive virtual reality experiences to advancements in neural networks. Throughout this journey, we remain steadfast in our commitment to integrity, sustainability, and giving back to our communities. These values not only guide us but also inspire the very innovation we strive for.

Senior Engineer Opportunity at Micron:

As a Senior Engineer specializing in Package-Silicon Integration at Micron's Package Development Engineering (PDE) Group, you will play a crucial role in advancing IC package development for upcoming silicon and package technologies.

You will work closely with different teams including silicon wafer design, package design, and wafer fabrication to meet project needs. Your efforts will drive technology advancements across various stages of product development, aligning with Micron's strategic goal of achieving Technology leadership.

Responsibilities:

  • Collaborate with package design and development teams to assess chip package interaction risks.
  • Address dicing issues and enforce design rules and design FMEA in collaboration with scribe designers and assembly engineers.
  • Work with R&D/manufacturing wafer fabs and packaging teams to resolve issues, enhance yield, quality, and manufacturability.
  • Contribute to the progress of new silicon and package technologies by working closely with Micron's internal facilities.
  • Define test vehicles, conduct DOEs, evaluate enabling technologies, document best-known-process, and hand over to manufacturing.
  • Identify technology, quality, and business process gaps, and implement necessary solutions to bridge them.
  • Act as a primary point of contact with Si design, scribe design, and wafer fab teams to track the advancement of key projects.

Requirements:

  • PhD, Masters, or Bachelor's degree in Engineering (Mechanical, Materials Science, Electrical, Chemical).
  • 4-5 years of experience in the semiconductor industry, specifically in assembly or wafer fabrication within fab.
  • Demonstrated proficiency in organizing work, decision-making, and prioritization.
  • Knowledge of PFMEA, DFMEA, DOE, Fish-Bone Analysis is desirable.
  • Strong analytical, problem-solving, and organizational abilities.
  • Proficiency in computer applications such as Excel, Word, and Power Point.
  • Self-driven and adept at working in a team environment.
  • Excellent interpersonal, oral, and written communication skills in English.

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