Sr. Engineer, PDE Advanced Packaging FEOL

2 weeks ago

Singapur, Singapore Micron Full time

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

JR47847 Sr. Engineer, PDE Advanced Packaging FEOL

Job Responsibilities:

Identify, select, and evaluate new equipment/ new technology to support current and future requirements for FEOL area

Define, development and establish new equipment design/ capability requirements aligned to Process and Packaging Roadmap

Develop and engage creative solution for new equipment capabilities/ solution to identified constraints or future technology requirements

Work with equipment suppliers to develop new capability

Engage in active participation in Package Development Engineering activities

Conducts equipment benchmarking to establish the equipment suppliers and platforms for future need

Create decision matrix for equipment and material selection

Installation and qualification of new equipment platform and handover to production group (pilot line setup)

Plan/submit capital request to acquire new Equipment

Create purchasing specification (Doc2) document

Establish the new equipment qualification criteria and activities roadmap with respective functional - team

Establish project handover requirements and procedures upon machine qualification

Prepare documentation for handing over with respective site owner

Conduct data gathering for low volume production

Conduct training for Site representatives

Feedback loop for Continuous Improvement after mass volume production

Maintain a matrix of key equipment platform capability and constraints (TOR - Tool of Records) on current and new equipment platform

Maintain and regularly update the TOR, with inputs from local or other assembly site

Maintain general knowledge of process and material characteristics and translate to equipment design requirement

Search continually for new equipment or suppliers with improved or new capability that is aligned to Process/Packaging need

Collaborate with production group on upgrades of existing production equipment through continuous improvement projects

Maintain knowledge of design constraints and weakness of existing platform

Participate in the continuous improvement projects involving equipment improvement and upgrades

Job Requirements/ Qualifications:
- PhD/Masters/Bachelor's Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required
- Basic knowledge in semiconductor manufacturing assembly & wafer bumping packaging technologies & techniques
- Minimum 2 years' experience in related semiconductor industry
- Experience with technical knowledge on assembly and/or wafer bumping packaging technology
- Advantage packaging technology and Front end of line background will be preferable and plus point
- Understanding and/or experience in equipment automation solution GEM300, AMHS and IIOT solution for datamation such as APC, FDC, E3, PCS, SPC) is a plus
- Fast learner, with initiative and independence (min supervision)
- Good team player, ability to integrate and cooperate with cross function teams and external vendors
- Strong communication and presentation skills
- Understanding of business needs and customers' requirement
- Strong project management skills to ensure execution to timelines

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