Engineer FE CPIE PI

2 weeks ago


Singapore MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. Full time
Roles & Responsibilities

FE Central Product Integration Engineering (CPIE) HPM PI Engineer

As FE CPIE HPM (High Performance Memory) PI Engineer at Micron Technology, Inc., you will be responsible for working with global Micron network to drive HPM Product yield, quality improvement, new product introduction (NPI) through technical expertise, business process management and project execution.

Responsibilities and Tasks

  • Promote worldwide synergy for improved benchmark performance and efficiency gains through global project management and execution, network BKM leveraging and enhancement, and business process creation and re-engineering.
  • Active engagement with PI Loop taskforce and/or team in network to address yield and quality challenges, optimize process flow in a timely manner to achieve BIC yield performance.
  • Maintain and enhance domain knowledge and technical expertise, explore innovation opportunities with strategic thinking and systematic approach.
  • Maintain a strong and open relationship with peer group and managers in other functional areas within central team and outside in areas such as Fab, TD, Product Engineering, GQ. Communicate and respond to issues in a timely manner. Help drive to fix the issue where necessary.
  • Demonstrate ability to give effective presentations to both small and large groups on project updates and new initiative proposals.
  • Periodically follow up with manager to ensure all type of goals are met and get assistance to remove obstacles.
  • Travel to Micron Fab locations as necessary for face-to-face collaboration for program requirements.

Requirements

  • Background in electrical engineering, materials science, transistor physics and semiconductor process knowledge.
  • Experience with Semiconductor Device Physics, DRAM operations, wafer fabrication process flows, parametric/electrical test, and probe yield will be an added benefit to this position.
  • Good data analysis, troubleshoot, problem solving, reporting and presentation skills.
  • Good multi-tasking, verbal, and written communication skills.
  • Strong interpersonal skills and customer/co-worker relationships. Successfully demonstrated teamwork skills with a strong focus on developing good team dynamics.
  • Good organizational capabilities and ability to work effectively with minimal supervision.
  • Intermediate to advanced PC skills including Microsoft Office.
  • Ability to be flexible with job responsibilities and take the initiative to assume added responsibilities.
  • Travel Required: Yes. Willing to travel as needed to support department goals
  • Travel Frequency: 20-50%.

Education

  • Bachelor’s degree and above in Electrical Engineering, Microelectronics, Physics, Chemistry, Materials Science or related field of study

Tell employers what skills you have

Materials Science
Dynamics
Quality Improvement
Physics
Reengineering
Product Engineering
Fabrication
Chemistry
Transistor
Presentation Skills
Business Process
Teamwork Skills
Business Process Management
Electrical Engineering

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