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Job Summary The Metrology Engineer (DRSEM / CDSEM / AFM) supports translational semiconductor research by bridging advanced metrology development with industry‑relevant manufacturing practices. The role focuses on operational engineering control of critical dimension and surface metrology platforms within a research fab or pilot line environment. The...

Job Summary Advanced Packaging Bonding Engineer supports translational semiconductor research by bridging advanced packaging innovations with industry‑relevant manufacturing practices. The role focuses on operational engineering control of bonding processes—including wafer‑to‑wafer, die‑to‑wafer, and hybrid bonding—within a research fab or...

Job DescriptionProvide reactive and proactive technical support for customers including machine and process troubleshootingCoordinate hot issues with regional product support, customer operations and regional service managersAct as high-level technical resource for all of applications as well as sales, field service, product marketing and, of course, our...

Job DescriptionProvide reactive and proactive technical support for customers including machine and process troubleshootingCoordinate hot issues with regional product support, customer operations and regional service managersAct as high-level technical resource for all of applications as well as sales, field service, product marketing and, of course, our...

The CMP Engineer supports translational semiconductor research by bridging advanced material integration and planarization process development with industry‑relevant manufacturing practices. The role focuses on operational engineering control of CMP platforms within a research fab or pilot line environment, ensuring process robustness, repeatability and...

Job Description The advanced Packaging Program at the Institute of Microelectronics (IME) is seeking a passionate and skilled Scientist or Senior Scientist to join our team. This role is pivotal in advancing the state‑of‑the‑art advanced packaging platform technologies, such as 2.5D/3D IC and Co‑packaged optics. Development of critical modules...

Job Description The advanced Packaging Program at the Institute of Microelectronics (IME) is seeking a passionate and skilled Scientist or Senior Scientist to join our team. This role is pivotal in advancing the state‑of‑the‑art advanced packaging platform technologies, such as 2.5D/3D IC and Co‑packaged optics. Development of critical modules...

Job Description Position Role Process Integrator for Advanced Package Assembly for Heterogeneous Integration The Advanced Packaging Program at the Institute of Microelectronics (IME) is seeking a passionate and skilled Scientist or Senior Scientist to join our team. This role is pivotal in advancing the state‑of‑the‑art...

Job Description The advanced Packaging Program at the Institute of Microelectronics (IME) is seeking a passionate and skilled Scientist or Senior Scientist to join our team. This role is pivotal in advancing the state‑of‑the‑art advanced packaging platform technologies, such as 2.5D/3D IC and Co‑packaged optics. Development of critical modules...

Cleaning Staff Singapore(Islandwide) Cleansing & Housekeeping, SGD$1,600 - SGD$3,200 Job Description: Cleaners perform a wide range of duties to keep a business tidy. They’re also responsible for performing routine inspections to ensure that spaces like restrooms are sanitary. AWS (13 Month Bonus) Variable Bonus (Depend on individual and company...

Campus Cleaner Singapore(Islandwide) Cleansing & Housekeeping, SGD$1,200 - SGD$1,600 Job Description: Cleaners perform a wide range of duties to keep a business tidy. They’re also responsible for performing routine inspections to ensure that spaces like restrooms are sanitary. AWS (13 Month Bonus) Variable Bonus (Depend on individual and company...

Job Summary Advanced Packaging Bonding Engineer supports translational semiconductor research by bridging advanced packaging innovations with industry‑relevant manufacturing practices. The role focuses on operational engineering control of bonding processes—including wafer‑to‑wafer, die‑to‑wafer, and hybrid bonding—within a research fab or...

The CMP Engineer supports translational semiconductor research by bridging advanced material integration and planarization process development with industry‑relevant manufacturing practices. The role focuses on operational engineering control of CMP platforms within a research fab or pilot line environment, ensuring process robustness, repeatability and...

**Job Description** The advanced Packaging Program at the Institute of Microelectronics (IME) is seeking a passionate and skilled Scientist or Senior Scientist to join our team. This role is pivotal in advancing the state-of-the-art advanced packaging platform technologies, such as 2.5D/3D IC and Co-packaged optics. Development of critical modules includes...

Job Summary The Metrology Engineer (DRSEM / CDSEM / AFM) supports translational semiconductor research by bridging advanced metrology development with industry‑relevant manufacturing practices. The role focuses on operational engineering control of critical dimension and surface metrology platforms within a research fab or pilot line environment. The...

Job Description Position Role Process Integrator for Advanced Package Assembly for Heterogeneous Integration The Advanced Packaging Program at the Institute of Microelectronics (IME) is seeking a passionate and skilled Scientist or Senior Scientist to join our team. This role is pivotal in advancing the state‑of‑the‑art...

Job Description Provide reactive and proactive technical support for customers including machine and process troubleshooting Coordinate hot issues with regional product support, customer operations and regional service managers Act as high-level technical resource for all of applications as well as sales, field service, product marketing and, of course, our...