Flip-Chip Packaging Process Engineer – Yield

Lumilens in Singapore is seeking a professional to own process development and technical support of the Flip Chip process for silicon photonic chip wafers. The candidate should have over 5 years of hands-on experience in flip chip assembly and a degree in Materials Science or related fields. Key responsibilities include managing incoming material quality...

Company:RF360 Singapore Pte., Ltd.Job Area:Engineering Group, Engineering Group > Hardware EngineeringGeneral Summary:As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer,...

RF360 SINGAPORE PTE. LTD. is seeking a hands-on Process Engineer to support backend semiconductor packaging operations, focusing on wafer bumping, singulation, grinding, and mounting. You will provide day-to-day engineering support to meet production goals. The role emphasizes data-driven problem solving, continuous improvement, and close collaboration with...

Lumilens Inc. in Singapore seeks an experienced process engineer to own flip chip process development for silicon photonic wafers. You will lead DOE studies, optimize integration with upstream steps, and drive reliability validations through TCT, HAST and HTS. Required: 5+ years in flip chip assembly, strong FEM knowledge, and proficiency with JMP or...

Core Responsibilities Owns the process development and technical support of the Flip Chip process for silicon photonic chip wafers, with OSAT or internal line. Process may include plasma cleaning, flux engineering, pick & place, reflow, underfill, curing and/or TCB/NCP flux-less flow. DOE to characterize process window and margin. Optimize process...

About LUMILENS At Lumilens we are building the critical photonics infrastructure that powers tomorrow's AI supercomputing. From chip-to-chip optical interconnects to scalable photonic engines, Lumilens is unlocking a new era of computing - faster, cooler, and massively more efficient. We're a well-funded startup backed by Mayfield and led by veterans...

Core Responsibilities Owns the process development and technical support of the Flip Chip process for silicon photonic chip wafers, with OSAT or internal line. Process may include plasma cleaning, flux engineering, pick & place, reflow, underfill, curing and/or TCB/NCP flux-less flow. DOE to characterize process window and margin. Optimize process...

Broadcom Inc. is seeking an experienced package design engineer to develop complex flip-chip-BGA packages for ASICs used in AI, networking, HPC, and 5G. You will help enable high-performance SerDes at 200G and above, RF/microwave ADC/DAC, DDR, and HBM through careful layout, impedance matching, and thermal management. You will work with a worldwide R&D...

Job Summary: We are seeking a motivated and hands-on Process Engineer to support backend semiconductor packaging operations, with primary focus on wafer bumping, wafer singulation, wafer grinding/backgrind, and wafer mounting processes. The successful candidate will provide day-to-day engineering support to meet production output, product quality,...