Engineer - Test Maintenance (Wafer Sort)

Job Description: • Test program Development for Digital, Power Management, RF & Mixed Signal Integrated• Circuits (IC's) using Automated Test Equipment (ATE) for wafer sort and packaged IC's• Design Test Hardware Load board and Probe Card• Work closely with the design engineers on the first silicon debug, device characterization, test• program...

• Monday to Friday, 9am - 6pm• Working location: Woodlands• No experience is welcome to apply! Training is provided• Permanent role Our client is a MNC providing hardware testing for the semiconductor industry with more than 1000 employees worldwide.Due to expansion plans, our client is looking for talented individuals to join their team. Job...

About Company Hiring Company is an international, industry-known brand that provides high-end process equipment for fast-growing specialty applications in the semiconductor industry. Our Company designs and manufactures wet chemical etching and wet cleaning equipment for our customer who are wafer fabs worldwide. Our products are integrated in the global...

About Company Hiring Company is an international, industry-known brand that provides high-end process equipment for fast-growing specialty applications in the semiconductor industry. Our Company designs and manufactures wet chemical etching and wet cleaning equipment for our customer who are wafer fabs worldwide. Our products are integrated in the global...

Key Responsibilities: Perform wafer testing using designated wafer platforms in accordance with the production schedule. Conduct die testing on assigned die platforms as per operational timelines. Carry out die sorting activities on the sorting platform following the established work plan. Maintain compliance with 6S standards to ensure a clean and organized...

Job Responsibilities Responsible for New Product Introduction, initial phase of silicon bring up working with NPI Product and Test team Collaborate with cross functional teams, (Test, Foundry, Reliability, Engineering teams) to drive NPI development. Analyze yield at engineering sample phase and characterize NPI product performances and manufacturing yield...

Package Design Engineer is responsible for product and tooling design.Candidates with wafer bumping, WLCSP, BGA or fanout packaging experience are encouraged to apply for this position.Responsibilities With reference to internal design guidelines, work with the internal & external customer to: Generate, update, and revise electrical routing layout based on...

Summary The Head of Operations – Wafer Level Dicing (WLD) is responsible for overseeing all WLD manufacturing operations, ensuring excellence in quality, cost, delivery, and innovation. This role drives operational strategy, efficiency improvements, and performance excellence across manufacturing, process, and equipment functions to achieve world‑class...

SSMC (Systems on Silicon Manufacturing Company Pte. Ltd.), is a Joint Venture between NXP and TSMC. We offer flexible and cost-effective semiconductor fabrication solutions by maintaining fully equipped SMIF cleanroom environment, 100% equipment automation and proven wafer-manufacturing processes.We're looking for innovative, passionate, and talented people...

SSMC (Systems on Silicon Manufacturing Company Pte. Ltd.), is a Joint Venture between NXP and TSMC. We offer flexible and cost-effective semiconductor fabrication solutions by maintaining fully equipped SMIF cleanroom environment, 100% equipment automation and proven wafer-manufacturing processes. We're looking for innovative, passionate, and talented people...