Scientist (Heterogeneous Integration), IME
3 weeks ago
Overview
Scientist (Heterogeneous Integration), IME
The Heterogeneous Integration Department at the Institute of Microelectronics (IME) is seeking a passionate and skilled Principal Scientist to join our team. This role is pivotal in advancing state-of-the-art chip-to-wafer and wafer-to-wafer hybrid bonding processes, developing cutting-edge fabrication techniques for 2.5D and 3D packaging applications, and conducting electrical and reliability characterisation. The position provides an exciting opportunity to contribute to groundbreaking technologies and collaborate with a dynamic team of researchers and external stakeholders.
Responsibilities- Collaborate with senior staff, process integrators, and external partners to address technology roadmaps, process capability requirements, and business challenges.
- Lead high-impact projects with manageable risks and mentor less experienced colleagues.
- Conceive and plan projects involving new materials, advanced process integration approaches, and innovative concepts.
- Research and develop advanced packaging technology such as flip-chip and hybrid bonding techniques for 2.5D and 3D IC applications.
- Investigate and refine wafer bonding processes for interposer fabrication, inter-dielectric gap fill, and alignment accuracy, addressing factors such as warpage, bonding strength, and yield.
- Optimise die bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, and bonding methods.
- Conduct engineering experiments for process characterisation to drive quality and yield improvements.
- Perform reliability characterisation of hybrid-bonded packages to ensure robustness and long-term performance.
- Act as a subject matter expert (SME) for internal and external stakeholders, providing guidance and expertise.
- Inspire and mentor talents in semiconductor technology, contributing to workforce development in the field.
- Work with minimal supervision and be a team player.
- Educational Background: PhD in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field.
- Experience: 0 to 5 years of experience in microelectronic devices, circuits, and hybrid component integration, 2.5D/3D heterogeneous integration applications.
- Technical Expertise: Knowledge in hybrid bonding or flip chip bonding is a plus.
- Knowledge: Strong knowledge of hybrid bonding equipment technologies and bonding materials and methodologies, and reliability characterisation is preferable.
- Skills: Strong analytical and problem-solving skills. Proficiency in data analysis and interpretation and design of experiments.
- Excellent written and verbal communication abilities.
- Teamwork: Ability to work collaboratively in a research-oriented environment (OEMs, customers, and internal stakeholders). Demonstrated ability to manage multiple tasks and projects simultaneously.
- Demonstrated expertise in heterogeneous integration, hybrid bonding, and advanced packaging processes.
- Proven ability to troubleshoot and resolve process-related challenges.
For further inquiries or additional information, please contact our HR. We look forward to receiving your application and exploring the potential for you to join our innovative team.
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