Manager, Process Engineer
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Applied Materials is seeking a Manager, Process Engineering (Electroplating) to join our Singapore's Advanced Packaging Development Center (APDC) team. This role will lead the development and optimization of next-generation electroplating processes and technologies for advanced semiconductor packaging applications. The successful candidate will manage a team of engineers, drive process innovation, support customer engagements, and collaborate across global cross-functional teams to deliver differentiated products and technology solutions.
Key Responsibilities- Manage engineers in utilizing techniques to characterize hardware, define methods and new technologies and apply them to characterize hardware, and/or perform hardware characterization on significantly complex systems for entire range of products
- Manage, develop, plan and execute process engineering projects for entire range of products
- Interact with key customers to resolve significantly complex process engineering issues for entire range of products
- Develop and implement new technology, products and analytical instrumentation
- Train, define and implement new methodologies, define and apply new technologies, and/or troubleshoot, perform Root Cause Analysis, and resolve significantly complex process engineering issues for entire range of products
- Generate internal and external documentation for products, presentations and technical reports for integrated products and generate and/or validate process engineering specifications for integrated products
- Contributes to market share gains through technology improvement
- Bachelor’s, Master’s or PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, or related field.
- 8+ years of semiconductor process engineering experience, including hands‑on expertise in electroplating/electrochemical deposition technologies.
- Strong knowledge of copper plating, wafer‑level packaging, RDL, copper pillars, TSVs, and advanced packaging applications.
- Proven experience leading process development, technology innovation, and product qualification in an R&D environment.
- Demonstrated people leadership experience, with the ability to develop and mentor engineering teams.
- Expertise in process characterization, DOE, statistical analysis, troubleshooting, and root cause analysis.
- Strong understanding of plating chemistry, deposition uniformity, defect reduction, and process optimization.
- Experience collaborating with customers and cross‑functional teams to resolve complex technical challenges.
- Excellent communication skills with the ability to prepare technical reports, specifications, and executive presentations.
- Science Park II (Moving to Tampines office starting Apr 2027)
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