Semicon Process Senior/Engineer

3 hours ago

Singapur, Singapore People Profilers Full time

Responsibilities

  • Develop AOI inspection conditions and perform defect analysis for bump, RDL, and TSV processes
  • Operate and optimize 2D/3D AOI systems and inspection parameters
  • Configure AOI inspection algorithms for new product designs
  • Set up process conditions and equipment configurations for new packages and production lines
  • Optimize reflow parameters and temperature profiles
  • Analyze solder/micro bump quality and implement improvements
  • Conduct root cause analysis and implement corrective actions for process issues
  • Support customer quality requirements through technical evaluation and documentation
  • Support mass production and quality control in the advanced semiconductor packaging process
  • Contribute to defect reduction, process stability, and customer satisfaction
  • Drive yield and reliability improvements in AOI and reflow process areas
Qualifications
  • Bachelors degree or higher in Engineering or Science (e.g., Material Science, Chemical Engineering, Electronics)
  • Minimum 3 years of experience in AOI or reflow process in semiconductor backend
  • Ability to establish process conditions and optimize parameters
  • Strong data analysis and problem-solving skills
  • Proficient in writing technical documents and communicating in English
  • Knowledge of inspection or reflow/soldering principles
  • Experience in defect analysis and developing defect evaluation criteria
  • Required experience with bump and RDL inspection
  • Basic understanding of thermal, electrical, and material behavior in reflow processes
  • Experience in advanced packaging process such as 2.5D, fan-out and flip-chip
  • Familiarity with quality tools such as APQP, FMEA and 8D methodology
  • Experience in responding to customer quality requirements or certification audits
  • Ability to write technical documentation and communicate in English
  • Hands-on experience with major AOI equipment (e.g., KLA, Onto, Camtek)
  • Collaborative experience in AOI image analysis and algorithm development
  • Experience in developing inspection criteria and technologies for parameters such as co-planarity, tilt, and voids
  • Experience in quality and reliability evaluation related to reflow or soldering processes
  • Understanding of associated assembly/joining processes (e.g., bonding, chip attach)

All successful candidates can expect a very competitive remuneration package and a comprehensive range of benefits.

Please note: We regret that only shortlisted candidates will be notified.

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