MTS/ Principal/ Senior/Engineer, Advanced Packaging Integration

Overview

MTS/ Principal/ Senior/Engineer, Advanced Packaging Integration - Post Wafer Fabrication (PWF)

We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team focused on using expertise in the relentless pursuit of innovation for customers and partners. The solutions we create help enable technologies from virtual reality to breakthroughs in supercomputing and AI, while committing to integrity, sustainability, and giving back to communities.

Micron’s Advanced Packaging Technology Development (APTD) delivers package development for high performance memory products and transfer to manufacturing. This role supports the development and deployment of advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability, and schedule requirements.

• Develop and enable advanced package technology for various post-fab wafer finish and assembly processes
• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity
• Integrate semiconductors while partnering with process and product engineering teams
• Work with internal and external stakeholders to build and execute technology development strategies aligned with objectives
• Collaborate with PWF Engineering, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality to integrate manufacturing processes for optimal performance and quality control
• Ensure smooth transition from new product development, qualification, small volume production to high volume production
• Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production High Volume Manufacturing Fabrication facilities

• Achieve and improve yields through silicon package integration innovation and data-driven decisions
• Collect and analyze data to drive layout, design, or integration flow changes
• Work with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements
• Establish correlations between defense mechanisms to identify improvement opportunities

• B.S./M.S./Ph.D. (or equivalent) in Electrical, Mechanical, Chemical, Physics, Materials or related fields
• 5 or more years of semiconductor process integration experience, with know-how to develop and enable advanced package technology for post-fab wafer finish and assembly processes
• Strong understanding of process flows and interactions; ability to integrate semiconductors with process and product engineering teams
• Ability to resolve complex issues through root-cause or model-based problem solving
• Tenacity to work effectively under timelines and limited resources
• Proven track record of solving problems and addressing root causes

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a focus on customers, technology leadership, and manufacturing excellence, Micron delivers high-performance memory and storage products through the Micron and Crucial brands. Our innovations fuel the data economy, enabling advances in AI and 5G across data centers, intelligent edge, and client experiences.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact

Micron does not charge candidates any recruitment fees or unlawfully collect any payment from candidates for employment. Micron prohibits child labor and complies with applicable laws and standards.

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