Senior / Engineer – Yield & Process Integration

2 weeks ago


Singapur, Singapore UTAC Full time

Overview

Senior / Engineer – Yield & Process Integration. Focus on process yield engineering and bump process integration. Collaborate with cross-functional teams to troubleshoot and resolve process-related issues observed during the wafer bumping process (Dry and Wet), including the proposal and execution of Design of Experiments (DOEs).

Responsibilities
  • Focus on process yield engineering and bump process integration. Collaborate with cross-functional teams to troubleshoot and resolve process-related issues observed during the wafer bumping process (Dry and Wet), including the proposal and execution of Design of Experiments (DOEs).
  • Analyze data for yield and detect trends.
  • Execute CIP (Continuous Improvement Program) or project activities that contribute to yield and cost-efficiency improvements.
  • Review and propose updates to calculated Statistical Process Control (SPC) limits to improve product quality and ensure process stability.
  • Take ownership of customer technical inquiries, perform detailed spec reviews, and lead the implementation of requirements for product offload transition from New Product Introduction (NPI) to mass production.
  • Act as the overall coordinator of customer-initiated BKM exercises.
Requirements
  • Degree in Engineering
  • Minimum 3 years of relevant experience, preferably in the semiconductor industry
  • Familiar with SPC, APQP, and data analysis tools
  • Strong problem-solving and analytical skills
Seniority level
  • Executive
Employment type
  • Full-time
Job function
  • Engineering and Manufacturing
Industries
  • Semiconductor Manufacturing
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