Frontend(FE) CPIE

Overview Frontend(FE) Central Product Integration Engineering (CPIE) HPM (High Performance Memory) Process Integration Senior Manager/Manager As FE CPIE (Central Product Integration Engineering) HBM (High Bandwidth Memory) Integration Senior Manager at Micron Technology, Inc., You will be responsible for providing leadership to the global Micron network to drive HBM product cummulative yield, quality improvement, new product introduction (NPI), with the primary focus on the FE (FrontEnd) and advance packaging unique challenges on HBM products. This team will play a crucial role in ensuring seamless collaboration for FE team with Advance Packaging Process teams, focusing on improving assembly yield and product quality. This position involves developing and disseminating Best-Known-Methods (BKMs) to our facilities in Japan, Taiwan, and the US, driving product maturity within a defined schedule while maintaining the highest standards of quality. Responsibilities and Tasks STRATEGIC LEADERSHIP Work with FAB to aim for best-in-class (BIC) Yield ramping. Work with key business partners to develop strategic Process Integration tools, systems, methodologies, capabilities and roadmaps. Ensure such support and roadmaps meet business expectations to enable achievement of strategic objectives and Micron’s business plan. Create an environment with your group that encourages innovation and technical leadership. TACTICAL LEADERSHIP Conduct ongoing metrics reviews of critical group deliverables to business. Ensure work reviews are conducted on all programs, projects and critical activities to ensure achievement of committed performance. Establish structure for subordinate manager to conduct such reviews within their teams. Ensure such reviews are aligned and effective. Provide direct leadership on most critical group deliverables and called out performance items to ensure barriers are removed and correct resources are applied. Ensure timely and transparent communication with business partners if performance issues will risk business objectives. Provide periodical one-on-one sessions to review progress to the Work Plan and adjust training and performance goals. PERFORMANCE MANAGEMENT Ensure clear direction, performance goals, job profiles and job expectations are established for all Team Members. Partner with Team Members on establishing ambitious but achievable goals. Maintain a balance between task-related goals versus results-driven goals. Drive accountability through clear communication, informal feedback, effective project management, and appropriate usage of metrics. COMMUNICATION Provide regular and structured communications to your team, including progress toward strategic objectives, Operations goals, priority projects, and company status. Ensure Team Members are well-engaged and motivated to achieve group and company objectives. Ensure subordinate managers communicate consistently and in alignment with your regular communications. Ensure structured communications with Team Members provide proper motivation and optimism toward achieving Process Integration Engineering vision and mission. Develop external relationships to achieve new ideas and procedures to keep pace with industry standards and methods. TRAINING AND CAREER DEVELOPMENT Ensure the group’s training roadmap is maintained. Focus on developing leading-edge skills and preventing isolated abilities that risk business continuity. Ensure leaders set specific training plans, performance goals and development activities for their Team Members. Develop potential successors within your group and coach/mentor to develop skills. Requirements At least 2 years experience as Process Integration (PI)/ Yield Enhancement(YE)/ Process & Equipment(PEE) Managers in Wafer Fabrication Field Experience on High Band Width Memory (HBM product or advanced packaging will be a plus to this job position. Travel Required: Yes. Willing to travel as needed to support department goals Travel Frequency: 20-50%. #J-18808-Ljbffr