Intern - Chemical & Mechanical Polishing (CMP)
5 months ago
Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
JR48191 Intern - Chemical & Mechanical Polishing (CMP)Location:
1 North Coast Drive, Singapore
Department:
High Volume Manufacturing (HVM) - Chemical & Mechanical Polishing (CMP) Engineering
Project Title:
Wafer Run-to-Run (R2R) control optimization
Description:
This internship program aims to provide students with an opportunity to improve latest state of the art R2R controller to enable more precise tuning to improve product quality, in which, paving a way to be offered full time employment with the Process anf Equipment team. Wafer run-to-run control is widely used in semiconductor industry to reduce process drift, shift and improve robustness of processes.
Scope:
Student will be given an opportunity to learn:
• Chemical & Mechanical Process and Equipment Technology.
• To do data analysis and characterization of CMP process variations.
• Hands-on work to establish, modify and improve CMP process parameters.
• Upgrade CMP process control capability and reduce production cycle time.
Deliverable:
To analyze and optimize existing R2R controller to reduce production line inefficiency to improve production cycle time.
Impact:
You will innovate to solve challenges in the latest NAND wafer fabrication process controls.
Internship Period:
Aug - Dec 2024 // 4 - 6 months
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