Yield & Process Integration Engineer
15 hours ago
**Responsibilities**:
- Focus on process yield engineering and bump process integration.
- Collaborate with cross-functional teams to troubleshoot and resolve process-related issues observed during the wafer bumping process (both Dry and Wet), including the proposal and execution of Design of Experiments (DOEs).
- Responsible to look into data analysis for yield and detect trend.
- Lead continuous improvement projects & device qualifications using APQP approach.
- Execute CIP (Continuous Improvement Program) or project handling that contributes yield & cost efficiency improvement.
- Review and propose updates to calculated Statistical Process Control (SPC) limits to improve product quality and ensure process stability.
- Take ownership of customer technical inquiries, perform detailed spec reviews, and lead the implementation of requirements for product offload transition from New Product Introduction (NPI) to mass production.
- Overall coordinator of customer's initiated BKM exercise
**Job Requirements**:
- Degree in Engineering.
- Minimum 3 years of relevant experience preferably in the semiconductor industry.
- Familiar with SPC, APQP, and data analysis tools.
- Strong problem-solving and analytical skills.
**Job Types**: Full-time, Permanent
Pay: From $4,000.00 per month
Work Location: In person
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