Engineer, Mechanical Analysis
10 hours ago
**Roles & Responsibilities**:
- Perform mechanical & thermo-mechanical analysis and characterization of advanced IC packages
- Build up new mechanical & thermo-mechanical capabilities with latest simulation and characterization technologies
- Design advanced packages for customers to meet their reliability and manufacturability specifications & needs
- Assess the feasibility of new packaging assembly and process technologies with respect to mechanical and reliability performance
- Conduct IC packaging technology development together with other teams
- Carry out mechanical and reliability test and correlate with mechanical & thermo-mechanical simulation for validation
**Requirements**:
- Degree / Master in Mechanical Engineering or related
- Solid knowledge on FEM & mechanics of material
- Mechanical modeling experience for IC package’s stress & warpage, board-level reliability such as drop test & TCOB using simulation software such as Ansys or Abaqus is a must
- Thermo-mechanical modeling experience for IC assembly molding process, die stress/shifting in fan-out WLP, and wire bonding using simulation software such as Ansys & Abaqus is preferable
- Mechanical and reliability test experience such as drop test, TCOB test, warpage measurement, bending test, material strength test is highly desirable
- Keen for R&D activities in IC packaging technology development, package’s mechanical & thermo-mechanical analysis/design/optimization/characterization
Reg No. R1549345
Triton AI Pte Ltd
License no. 21C0661
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