Research Engineer
1 week ago
Research Engineer will be part of heterogeneous integration group focused on development of the advanced packaging technology platforms for multi-chip wafer level package. He/she will work on the following tasks:
Plan and perform DOEs for various process development and materials evaluation for WLP
Establish integration flows for advanced packages
Coordinate and support engineering build of new packages and development
Work with industry partners and multidisciplinary team members to execute assigned tasks and resolve issues for projects
Publish new findings and technological advancement in prestigious journals and overseas/local conferences.
Job Requirements
University degree or Masters in Electronics / Microelectronics / Material Engineering / Material Science / Chemistry / Physics.
Prior experience in developing wafer level packaging
Knowledge of advanced packaging technologies such as photolithography, ECP, PVD, plasma and wet etching is preferred
Good analytical, communication and presentation skills
**Type of Employment**: Full-Time
**Minimum Experience**: 3 Years
**Work Location**: Science Park
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