Principal/senior Engineer, Advanced Package Metrology-real-time Defect Analysis

**Our vision is to transform how the world uses information to enrich life for all.**

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Key responsibilities and duties include:
Recipe Development and Optimization:

- Develop and optimize metrology recipes for various semiconductor processes
- Ensure that the recipes are accurate and efficient for production needs
- Develop and execute strategies for process monitoring, sampling, and continuous improvement (CIP)

Inspection and Characterization:

- Establish inspection methodologies and best-known methods (BKM) for metrology processes
- Perform in-line characterization and validation of metrology recipes

Data Analysis and Reporting:

- Utilize data analysis tools like Power BI to summarize and report on metrology recipe status and project progress
- Continuously analyze data to identify improvement opportunities and ensure process efficiency

Quality and Performance Indicators:

- Own and manage metrology tools, ensuring they meet performance indicators and quality standards
- Drive the defense line readiness and set up control plans, OCAP (Out of Control Action Plans), and SPC (Statistical Process Control) charts

Collaboration and Coordination:

- Engage in early involvement with Advanced Packaging Technology Development (APTD) to ensure seamless integration of new technologies
- Work closely with various teams, including the Package Integration, PWF/Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control

**Requirements**:

- B.S/M.S./Ph.D. (or equivalent education) in Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, or other related technical fields
- 2 or more years of semiconductor process or equipment engineering experience, preferably in wafer bonding, plating, warpage control and packaging field
- Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics.
- Experience with Visual Basic for automation and tool integration.
- Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
- Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
- Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability
- Hands on experience with wafer/assembly tools or metrology/RDA systems
- Tenacity to work effectively under timelines and limited resources
- Consistent track record to solve problems and address root causes

**About Micron Technology, Inc.**

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

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