Mts Advanced Packaging
3 days ago
**About**GlobalFoundries**
**Introduction**:
We are looking for an experience Engineer in Semiconductor Advanced Packaging. You will be the technical lead in the development, optimization, and implementation of advanced packaging technologies, ensuring high yield, quality, and reliability in semiconductor manufacturing. Additionally, you will establish and provide training programs for the Advance packaging Team.
**Your Job**:
- You will be responsible for the overall technology development, management and direction of Advanced Packaging process, equipment and materials definition, development and/or optimization.
- **Advanced Packaging Solutions**:drive experimental validation and characterization of advanced packaging solutions such as 2.5/3D CoWoS and DoW/WoW.
- **Technology & Product Roadmap enablement**:define and lead comprehensive material, process, and design characterization aligned to technology and product roadmaps.
- **Strategic Partnerships**:cultivate strong, strategic partnerships with internal engineering teams across packaging, reliability, device analysis, test, technology integration, and product development, and build collaborative relationships with external partners to leverage their expertise and resources.
- **Data Collection & Analysis**: lead collaborations with internal teams (characterization labs, reliability, failure analysis, design, test) and external partners (partners, OSATs, suppliers, universities) for data collection and analysis.
- **Technical Leadership**:provide expert guidance on metrology and package characterization techniques. Stay abreast of industry trends and advancements in semiconductor packaging and characterization. Mentor and guide junior engineers and technicians.
**Other Responsibilities**:
- Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs
**Required Qualifications**:
- B.S/M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields
- 5+ years of experience in Advanced packaging, metrology, characterization, design validation of components, packages, and platforms.
- Drive experimental validation and characterization of advanced packaging solutions such as TSV, WoW, DoW, Si bridge technologies.
- Experience with a variety of characterization methods including optical/electron microscopy, thermal-mechanical testing and spectroscopy (EDS, FTIR, XRF).
- Experience with data collection and analysis, including statistical methods.
- Demonstrated ability to work independently and in a team environment.
GlobalFoundries is an equal opportunity employer, cultivating a diverse and inclusive workforce. We believe having a multicultural workplace enhances productivity, efficiency and innovation whilst our employees feel truly respected, valued and heard.
As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.
-
Singapore GlobalFoundries Full timeMTS Advanced Packaging Lithography Process Engineering Join to apply for the MTS Advanced Packaging Lithography Process Engineering role at GlobalFoundries MTS Advanced Packaging Lithography Process Engineering 6 days ago Be among the first 25 applicants Join to apply for the MTS Advanced Packaging Lithography Process Engineering role at GlobalFoundries...
-
Singapore Goebel Fixture Company Full timeMTS Metrology and Inspection, ULP CMOS Advanced Packaging page is loaded MTS Metrology and Inspection, ULP CMOS Advanced Packaging Apply locations Singapore time type Full time posted on Posted 30+ Days Ago job requisition id JR- About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design,...
-
Singapore Goebel Fixture Company Full timeMTS Metrology and Inspection, ULP CMOS Advanced Packaging page is loadedMTS Metrology and Inspection, ULP CMOS Advanced Packaging Apply locations Singapore time type Full time posted on Posted 30+ Days Ago job requisition id JR- About GlobalFoundries: GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design,...
-
Mts Ic-advance Packaging Design Engineer
22 hours ago
Singapore Advanced Micro Devices, Inc Full timeOverview: - **WHAT YOU DO AT AMD CHANGES EVERYTHING** We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences - the building blocks for the data center, artificial intelligence, PCs, gaming and embedded....
-
Singapore Micron Technology Full timeJoin to apply for the MTS/ Principal/ Senior/Engineer, Advanced Packaging Die Level Technology role at Micron Technology 6 days ago Be among the first 25 applicants Join to apply for the MTS/ Principal/ Senior/Engineer, Advanced Packaging Die Level Technology role at Micron Technology Our vision is to transform how the world uses information to enrich life...
-
Singapore GlobalFoundries Full timeOverview MTS Advanced Packaging Etch Process Engineering role at GlobalFoundries. This position is part of Giga Fab in Singapore and focuses on developing and optimizing advanced packaging etch processes (e.g., TSV, plasma dicing, bond fabrication). The Etch Process Engineer reports to a functional area module manager and is involved in tooling start-up,...
-
Singapore Micron Technology Full timeOverview MTS/ Principal/ Senior/Engineer, Advanced Packaging Integration - Post Wafer Fabrication (PWF) We are looking for an Advanced Packaging Integration Engineer to join our Advanced Packaging Technology Development (APTD) team. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team focused on using...
-
Singapore GlobalFoundries Full timePrincipal/MTS Advanced Packaging Equipment Engineering (Diffusion/Metrology/Implant) page is loaded## Principal/MTS Advanced Packaging Equipment Engineering (Diffusion/Metrology/Implant)locations: Singaporetime type: Full timeposted on: Posted Yesterdayjob requisition id: JR- **Introduction to GlobalFoundries**GlobalFoundries (GF) is one of the world’s...
-
Mts Packaging Engineer
22 hours ago
East Singapore Emprego SG Full time**Location** Singapore, East **Job Type** Permanent **Salary** $7,300 - $12,500 Per Month **Date Posted** 5 hours ago Additional Details **Job ID** 16924 **Job Views** 1 **Job Description**: Roles & Responsibilities **What you do at AMD changes everything** At AMD, we push the boundaries of what is possible. We believe in changing the world...
-
Mts Package Cad Engineer
22 hours ago
Singapore Advanced Micro Devices, Inc Full timeOverview: **WHAT YOU DO AT AMD CHANGES EVERYTHING** We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our mission is to build great products that accelerate next-generation computing experiences - the building blocks for the data center, artificial intelligence, PCs, gaming and embedded....
